Designing 3D-ICs with integrity involves a commitment to ethical practices, reliability, and sustainability throughout the design and manufacturing process. This includes using environmentally friendly materials, ensuring robust and efficient performance, and incorporating thorough testing and verification. By prioritizing transparency, responsibility, and long-term sustainability, designers can create advanced integrated circuits that meet high standards of quality and social responsibility.
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Start with our Designing with Integrity 3D-IC online course, which introduces Integrity 3D-IC, the industry's first comprehensive, high-capacity 3D-IC platform that integrates 3D design planning, implementation, and system analysis in a single, unified environment. You will be guided through the following activities involved in designing a silicon interposer with a digital ASIC and HBM2 interface in a 2.5D configuration.
- You will design the interposer from scratch in the new Integrity System Planner and the Integrity 3D-IC implementation environment.
- You will examine the ASIC and interposer designs using some of the new 3D-IC multi-die design features.
- You will route the interposer using some of the new advanced routing capabilities with NanoRoute
—and this in only two days!
Interested? Get an overview in less than two minutes.
Are you primarily interested in selected snippets instead? Then, take our Training Bytes, which—like the online training course—are available to Cadence customers for free 24/7 in the Cadence Learning and Support portal.
Cadence Training Services now offers free Digital Badges for all popular online training courses. These badges indicate proficiency in a certain technology or skill and give you a way to validate your expertise to managers and potential employers. You can add the digital badge to your email signature or any social media channels, such as Facebook or LinkedIn, to highlight your expertise.
To find out more, see the blog post. It’s the Digital Era; Why Not Showcase Your Brand Through a Digital Badge!
Related Resources
- 3D-IC Introduction (Video)
- 3D-IC Development Process With Challenges. (Video)
- Demo: How to Create the Interposer Contact Pads and Die Connectivity Using the Integrity 3D-IC? (Video)
- Demo: How To Pull The Interposer Design From System Planner Into Integrity 3D-IC Layout? (Video)
- Demo: Routing The Interposer Design Using The Integrity 3D-IC Layout_Part 1 (Video)
- Demo: Routing The Interposer Design Using The Integrity 3D-IC Layout_Part 2 (Video)
- Demo: How To Create C4 Bumps For NC Connections And Generating C4 Dummy Cover Bumps In Integrity 3D-IC? (Video)
Related Blogs
- How Cadence Is Expanding Innovation for 3D-IC Design
- Training Bytes: They May Be Shorter, But the Impact Is Stronger!
- Training Insights — 3D-IC: What Is Silicon Interposer?
- System Analysis Knowledge Bytes: What’s New in the Clarity 3D Solver Course
- System Analysis Knowledge Bytes - Early System-Level Thermal Analysis
- 3D-IC: The Future of Integrated Electronics Is the Future of Electronics Itself